Cooling device using multiple fans and heat sinks

Details Cooling device using multiple fans and heat sinks Cooling device using multiple fans and heat sinks

2006-10-31

2006-10-31

Flanigan, Allen J. (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104330, C165S125000, C361S700000

Reexamination Certificate

active

07128135

ABSTRACT:
The present invention is directed to a method of constructing a semiconductor chip cooling device consists of multiple fans and heat sinks to provide redundant cooling capability. Heat coming from a semiconductor chip is first distributed to several heat sinks using multiple heat pipes. The heat sinks are placed around the fan outlet such that air is pulled in near the center of the fan and then pushed to across the heat sinks. Multiple fans and heat sinks are stacked up to form a complete cooling device. An external control circuitry is used to monitor and control the fans. In case of one fan fails, the other fans will be speeded up to make up the lost of air flow.

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