Heat exchange – Heat transmitter
Patent
1989-12-18
1998-02-03
Ford, John K.
Heat exchange
Heat transmitter
165 803, 165 804, 361702, 361704, 361715, 361716, 361719, F28F 700
Patent
active
RE0357219
ABSTRACT:
A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.
REFERENCES:
patent: 2965819 (1960-12-01), Rosenbaum
patent: 4226281 (1980-10-01), Chu
patent: 4235283 (1980-11-01), Gupta
patent: 4246597 (1981-01-01), Cole et al.
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4263965 (1981-04-01), Mansuria et al.
patent: 4448240 (1984-05-01), Sharon
patent: 4450693 (1984-05-01), Green et al.
patent: 4483389 (1984-11-01), Balderes et al.
patent: 4498530 (1985-02-01), Lipschutz
patent: 4535841 (1985-08-01), Kok
IBM Technical Disclosure Bulletin, vol. 24, No. 5, Oct. 1981, p. 2540.
Kammerer, HC Thermal Conduction Button, IBM Technical Disclosure Bulletin, vol. 19, No. 12, pp. 4622-4623, May 1977.
Dombroski et al, El Thermal Conduction Stud, IBM Technical Disclosure Bulletin, vol. 19, No. 12, pp. 4683-4685, May 1977.
Ashiwake Noriyuki
Daikoku Takahiro
Kawamura Keizo
Kobayashi Fumiyuki
Nakajima Tadakatsu
Ford John K.
Hitachi , Ltd.
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