Cooling device incorporating boiling chamber

Details Cooling device incorporating boiling chamber Cooling device incorporating boiling chamber

2005-09-26

2008-03-11

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S697000, C361S698000, C361S699000, C361S700000, C257S714000, C257S715000, C257S722000, C174S015100, C174S015200, C174S016100, C174S016300, C165S080300, C165S080400

Reexamination Certificate

active

07342785

ABSTRACT:
A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounting plate (16) located at a bottom surface (200) of the chamber. The fan duct is mounted to two opposite edges of the mounting plate. The fan is mounted in a front part while the heat sink is mounted in a rear part of the fan duct. A top wall (220) of the chamber has a plurality of fins (18) extending upwardly therefrom. The liquid has a level higher than that of a bottom surface of the top wall so that a constant contact between the liquid and the top wall is ensured.

REFERENCES:
patent: 5168919 (1992-12-01), Berenholz et al.
patent: 5508884 (1996-04-01), Brunet et al.
patent: 5630469 (1997-05-01), Butterbaugh
patent: 5647430 (1997-07-01), Tajima
patent: 6382306 (2002-05-01), Hsu
patent: 6550531 (2003-04-01), Searls et al.
patent: 6588498 (2003-07-01), Reyzin et al.
patent: 6609561 (2003-08-01), Sauciuc et al.
patent: 6650544 (2003-11-01), Lai
patent: 6714413 (2004-03-01), Ghosh et al.
patent: 6808015 (2004-10-01), Osakabe
patent: 6860321 (2005-03-01), Ji-Hai et al.
patent: 6918431 (2005-07-01), Reyzin et al.
patent: 6967845 (2005-11-01), Chiang et al.
patent: 7186590 (2007-03-01), Alcoe et al.
patent: 2003/0205363 (2003-11-01), Chu et al.
patent: 2528111 (2002-12-01), None
patent: 2588533 (2003-11-01), None
patent: 200418358 (2004-09-01), None
patent: M251193 (2004-11-01), None

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