Cooling device for semiconductor packages, having flexible film

Details Cooling device for semiconductor packages, having flexible film Cooling device for semiconductor packages, having flexible film

1993-12-07

1996-01-30

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257719, 257717, H01L 2334

Patent

active

054882559

ABSTRACT:
A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.

REFERENCES:
patent: 4935864 (1990-06-01), Schmidt et al.
patent: 5008582 (1991-04-01), Tanuma et al.
patent: 5132873 (1992-07-01), Nelson et al.
Technische Rundschau, vol. 84, No. 42, 16 Oct. 1992, Bern CH, pp. 72-73.

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