Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-06-22
2011-11-22
Datskovskiy, Michail V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679460, C361S689000, C361S699000, C361S702000, C361S703000, C361S715000, C165S080400, C165S080500, C165S104190, C165S104330, C257S714000, C062S259200, C307S009100, C307S010100, C307S043000, C363S065000, C363S141000, C363S143000
Reexamination Certificate
active
08064198
ABSTRACT:
A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins.
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Higashidani Yoshihiko
Kato Takeshi
Nagano Masao
Yoshino Tsutomu
Datskovskiy Michail V
Honda Motor Co. Ltd.
Squire Sanders & Dempsey (US) LLP
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