Heat exchange – Intermediate fluent heat exchange material receiving and... – Plural intermediate fluent heat exchange materials
Patent
1990-10-24
1993-03-23
Davis, Jr., Albert W.
Heat exchange
Intermediate fluent heat exchange material receiving and...
Plural intermediate fluent heat exchange materials
16510433, 165108, 361385, F28D 1502, H01L 23427
Patent
active
051955776
ABSTRACT:
A boiling type cooling device for cooling power semiconductors includes an evaporator containing an aqueous solution of ethylene glycol as a cooling medium, a condenser; and a vapor and liquid return pipe. According to a first aspect, the lowest portion of the condensor is at a level higher than the top surface of the cooling medium in the evaporator, the bottom surfaces of the condensor being tilted downward toward the top end of the liquid return pipe. According to another aspect, a pump is provided in the liquid return pipe for driving cooling medium to the evaporator. According to still other aspects, the liquid return pipe is covered with a heat insulating material, or a rubber string extends centrally therewithin. A deaeration device for the aqueous solution of ethylene glycol includes two separate deaeration baths and a mixing bath.
REFERENCES:
patent: 1701615 (1929-02-01), Grantier
patent: 1787562 (1931-01-01), Barlow
patent: 1792520 (1931-02-01), Weinhardt
patent: 2110774 (1938-03-01), Privett
patent: 3255813 (1966-06-01), Besson et al.
patent: 3561229 (1971-02-01), Levin
patent: 3609991 (1971-10-01), Chu et al.
patent: 4293030 (1981-10-01), Rambach
Kobayashi et al., "Development of High Power Semiconductor Equipment by Means of Boiling and Condensing Heat Transfer", Mitsubishi Electric Corporation Technical Journal, vol. 48, No. 2, Feb. 1974, pp. 229-239.
Jacquelin et al., "Refroidissement de Systems Electroniques de Puissanace", Sep. 1989, pp. 38-47.
Ashiya Masahiro
Kameda Takashi
Mori Ken-ichi
Takahashi Nobuyoshi
Yoshioka Takeo
Davis Jr. Albert W.
Mitsubishi Denki & Kabushiki Kaisha
LandOfFree
Cooling device for power semiconductor switching elements does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling device for power semiconductor switching elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device for power semiconductor switching elements will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1345685