Cooling device for mounting module

Details Cooling device for mounting module Cooling device for mounting module

1997-03-20

1999-01-19

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361690, 361703, 361709, 257719, 165 802, 165 803, H05K 720

Patent

active

058620389

ABSTRACT:
A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.

REFERENCES:
patent: 4235283 (1980-11-01), Gupta
patent: 4448240 (1984-05-01), Sharon
patent: 4462462 (1984-07-01), Meagher et al.
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4897764 (1990-01-01), Bruchmann et al.
patent: 5028989 (1991-07-01), Naganuma et al.
patent: 5291371 (1994-03-01), Gruber et al.
patent: 5390076 (1995-02-01), Umezawa

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