Cooling device for memory chips

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S709000, C361S719000, C165S104330, C165S185000

Reexamination Certificate

active

07408781

ABSTRACT:
A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of fins. A heat conduction member is connected with the cooling unit and inserted into a slot defined in one of the two side boards so as to directly in contact with the memory chips of the memory device. The heat is directly conducted to the heat conduction member and can be dispensed by the fins of the cooling unit.

REFERENCES:
patent: 7221569 (2007-05-01), Tsai
patent: 7312996 (2007-12-01), Chang
patent: 2007/0151705 (2007-07-01), Kwan

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