Patent
1975-02-24
1977-06-07
Wojciechowicz, Edward J.
357 74, 357 81, H01L 2302, H01L 2504, H01L 2312
Patent
active
040287238
ABSTRACT:
Within a refrigerant two planar semiconductor elements are sandwiched between two cooling member while another cooling member is interposed between the elements. The interposed cooling member includes three through holes vertically running through it and each of the outermost cooling members includes three grooves vertically extending throughout that surface remote from the semiconductor elements. An axial hole may be provided on each of the cooling members.
REFERENCES:
patent: 3573574 (1971-04-01), Davis
patent: 3711789 (1973-01-01), Dierschke
patent: 3743893 (1973-07-01), Yamomoto
patent: 3893162 (1975-07-01), Weidemann
Shikano Yoshiro
Ueoka Yasuhiro
Mitsubishi Denki & Kabushiki Kaisha
Wojciechowicz Edward J.
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