Cooling device for hard to access non-coplanar circuit chips

Details Cooling device for hard to access non-coplanar circuit chips Cooling device for hard to access non-coplanar circuit chips

1996-12-04

1998-08-18

Doerrler, William

Refrigeration

Structural installation

With electrical component cooling

16510421, 16510433, 361700, F25D 2312, F28D 1500

Patent

active

057944547

ABSTRACT:
Heat pipes are employed in conjunction with flexible flap thermal conductors to provide a mechanism for cooling high-powered electronic circuit chip modules which cannot otherwise be cooled by conventional means because of their non-coplanarity and their inaccessibility. More particularly, the present invention provides a mechanism for cooling electronic circuit chip modules which are disposed on circuit boards which are in close proximity to one another which fact precludes air cooling of heat sink structures and/or the imposition of a liquid-cooled cold plate due to the non-coplanarity and/or due to the inaccessibility.

REFERENCES:
patent: 4930317 (1990-06-01), Klein
patent: 5343358 (1994-08-01), Hilbrink
patent: 5343940 (1994-09-01), Jean
patent: 5353192 (1994-10-01), Nordin
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5413167 (1995-05-01), Hara et al.

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