Heat exchange – Flexible envelope or cover type
Reexamination Certificate
1999-07-02
2001-08-14
Atkinson, Christopher (Department: 3743)
Heat exchange
Flexible envelope or cover type
C165S080300, C165S185000, C257S722000, C361S697000, C361S709000, C361S701000
Reexamination Certificate
active
06273181
ABSTRACT:
CROSS REFERENCE TO RELATED APPLICATION
This application is based upon and claims priority from Japanese Patent Application Nos. Hei 10-205979, filed Jul. 22, 1998, and Hei 10-343176, filed Dec. 2, 1998, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a cooling device for electronic parts of a vehicle, and it is preferably applicable to an electronic element mounted in an engine room of a vehicle.
2. Description of Related Art
One type of known cooling device for electronic parts is disclosed in JP-A-9-207691. The cooling device disclosed in JP-A-9-207691 has a housing box (an electrobox) including a double structure of an inner box portion and an outer box portion. An electronic control unit (an electronic control circuit) is housed in the inner box portion, and cooling air is introduced to a cooling air passage between the inner box portion and the outer box portion to prevent the temperature increase of the electronic control unit.
According to the prior art, the cooling air is not introduced to the electronic control unit directly. Thus, even if the cooling air includes dust, water or the like, the electronic control unit is prevented from them.
However, the cooling performance of the above described prior art may not be sufficient because of the double structure of the housing box. In other words, the cooling air is not directly introduced to the electronic control unit, and such indirect cooling may not be enough to cool the electronic control unit.
SUMMARY OF THE INVENTION
The present invention is made in light of the above-mentioned problem, and it is an object of the present invention to provide a cooling device for electronic parts which improves its cooling performance while preventing dust, water or the like from electric parts.
According to a cooling device of the present invention, a case which accommodates an electronic element is housed in a housing box. An air passage is formed between the case and a main body of the housing box to introduce cooling air for cooling the electronic element in the case. A heat radiation member is attached to an inner surface of the case by a fixing member placed in a through hole formed in an area of the case to which the cooling air is not introduced.
Accordingly, the electronic element in the case is prevented from dust, water and the like. Further, the electronic element is efficiently cooled down by the cooling air passes through the air passage via the heat radiation member and the case because the electronic element makes contact with the heat radiation member.
According to another aspect of the present invention, the heat radiation member is fixed to an inner surface of the case at an area corresponding to the area to which the cooling air is not introduced, and the heat radiation member is extended along the inner surface of the case to an area corresponding to the air passage.
Accordingly, the electronic element is efficiently cooled down by the cooling air passes through the air passage while it is prevented from dust, water and the like.
REFERENCES:
patent: 3173477 (1965-03-01), Cuzzone
patent: 3369597 (1968-02-01), Dronsuth et al.
patent: 4763224 (1988-08-01), Bentz et al.
patent: 5276584 (1994-01-01), Collins et al.
patent: 5323847 (1994-06-01), Koizumi et al.
patent: 5969943 (1999-10-01), Oyamada
patent: 6050327 (2000-04-01), Gates
patent: 6104602 (2000-08-01), Morris et al.
patent: 0127825 (1989-05-01), None
patent: 402118379 (1990-05-01), None
patent: 9-47037 (1997-02-01), None
patent: 9-207691 (1997-08-01), None
Kobayashi Toshiki
Matsui Toshinori
Niimi Yukihide
Atkinson Christopher
Denso Corporation
Nixon & Vanderhye P.C.
LandOfFree
Cooling device for electronic parts of vehicle does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling device for electronic parts of vehicle, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device for electronic parts of vehicle will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2448956