Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-21
2011-06-21
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S691000, C361S704000, C361S719000, C257S707000, C174S015100
Reexamination Certificate
active
07965508
ABSTRACT:
A cooling device for cooling an electronic component (semiconductor module) includes a cooling tube adapted to be disposed in contact with the electronic component and having an internal coolant flow channel for the passage therethrough of a cooling medium, and a high-pressure tube disposed adjacent to a surface of the cooling tube that faces away from the electronic component, the high-pressure tube having a hollow interior that can be filled with a high-pressure fluid having a pressure higher than that of the cooling medium. An electric power conversion device comprised of a plurality of semiconductor modules and the cooling device as means for cooling the semiconductor modules is also disclosed.
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Japanese Office Action dated Dec. 9, 2008 issued in corresponding Japanese Application No. 2007-262805, with English translation.
Fukatsu Yoshiaki
Inoue Seiji
Yamamoto Takeshi
Denso Corporation
Gandhi Jayprakash N
Nixon & Vanderhye PC
Smith Courtney
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