Cooling device for electronic component

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

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Details

16510421, 361700, 257715, 174 152, F28D 1500

Patent

active

059244810

ABSTRACT:
A header tank for accommodating refrigerant is formed on one side of the cold plate, on the other side of which an electronic component is mounted. A plurality of loop pipes in which the refrigerant is circulated are connected with the header tank. The plurality of loop pipes are arranged substantially parallel with the cold plate. The radiating area of the loop pipes distant from the cold plate is larger than the radiating area of the loop pipes close to the cold plate.

REFERENCES:
patent: 2636752 (1953-04-01), Schane et al.
patent: 3143592 (1964-08-01), August
patent: 3476175 (1969-11-01), Plevyak
patent: 3653433 (1972-04-01), Scharli
patent: 4513346 (1985-04-01), Devins
patent: 4724901 (1988-02-01), Munekawa
patent: 4941530 (1990-07-01), Crowe
patent: 5168919 (1992-12-01), Berenholz et al.
patent: 5216580 (1993-06-01), Davidson et al.
patent: 5252778 (1993-10-01), Ogawa

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