Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-08-18
2008-09-02
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S093500, C361S700000, C165S080300, C165S080400, C165S104260, C165S104280
Reexamination Certificate
active
07420807
ABSTRACT:
The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit9and the air cooling unit12are formed in a unit. A heat absorption surface19of the liquid cooling unit9is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box2. In the liquid cooling unit9, a liquid cooling pump14composed of an electromagnetic pump is arranged for circulating the coolant in the flow path10. The heat generated by the heat generation components such as CPU6, heat generator7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit9by circulating the coolant with the liquid cooling pump14.
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Chinese Office Action dated Dec. 7, 2007.
Kitajo Sakae
Mikubo Kazuyuki
Ochi Atsushi
Sasaki Yasuhiro
Yamamoto Mitsuru
Datskovskiy Michael
Sughrue & Mion, PLLC
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