Heat exchange – Heat transmitter
Patent
1996-12-19
1998-08-11
Flanigan, Allen J.
Heat exchange
Heat transmitter
165 803, 361704, 2989003, H05K 720, H01L 2336
Patent
active
057914060
ABSTRACT:
In order to improve the function and to simplify the manufacture of a cooling device for electrical or electronic components, rib-like cooling elements are positioned parallel and at a predetermined distance from one another and are connected to a base plate in heat-transmitting contact. At least two cooling elements are combined into a unitary ribbon-shaped package having a U-shaped profile in cross-section and a web portion which connects the cooling elements. The cooling elements being fixed to the base plate in corresponding longitudinal slots.
REFERENCES:
patent: 1830375 (1931-11-01), Shoop
patent: 5499459 (1996-03-01), Jacoby
patent: 5518071 (1996-05-01), Lee
Transistor Heat Sink, J.B. Randolph, IBM Tech. Discl. Bul. vol. 14 No. 5 pp. 1489-1490, Oct. 1971.
IBM Technical Disclosure Bulletin, vol. 27, No. 10A, Mar. 1985. "Heat Sink Fabrication Method".
European Patent Office Search Report dated Jan. 24, 1996.
German Patent Office Search dated Feb. 20, 1995.
IBM Technical Disclosure Bulletin, vol. 25, No. 2, Jul. 1982; "Cooling Fin Structure", R. G. Biskeborn, J. L. Horvath and S. Oktay.
Patent Abstracts of Japan, E-650, Aug. 29, 1988, vol. 12/No. 318 for "Cooling Element and Manufacture Thereof".
Gonner Johannes
Masatz Joachim
Flanigan Allen J.
Hoogovens Aluminium Profiltechnik GmbH
LandOfFree
Cooling device for electrical or electronic components having a does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling device for electrical or electronic components having a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device for electrical or electronic components having a will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-379780