Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-04-24
1999-05-04
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 804, 257714, H05H 720
Patent
active
059010363
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The present invention is directed to a cooling device for electrical assemblies for mounting on a carrier.
The development of more and more powerful electronic assemblies also makes high demands of the cooling technology. A number of concerns are thereby raised in addition to the optimum heat elimination:
(1) The structure should be modular and flexible, i.e. assemblies other than those originally provided should be capable of being mounted. Given the increase in dissipated power, which derives, for example, due to higher performance data, the cooling unit should be adaptable to the new demands without involved modifications. Modifications of a mechanical nature (for example, housing dimensions, fastening capability) should also be taken into consideration.
(2) Manipulation in assembly and disassembly should be simple, for example when replacing assemblies during the course of a repair.
(3) An electrical insulation between the assemblies and the cooling system should be possible with simple means.
(4) Problems with the electrochemical compatibility of the material through which flow is conducted should be avoided.
(5) Finally, the cooling system should be low cost.
Conventional liquid coolers satisfy these demands relatively inadequately in practice. An integration of cooling channels in the assemblies themselves is standard. This, however, is involved and problematical in the assembly or, respectively, disassembly of the assemblies. The cooling water connections must be parted in the disassembly of the assemblies, whereby, in particular, care must be exercised to see that cooling water does not come into contact with voltage-carrying parts. Particular precautions must there for be taken. Such precautions, however, are time consuming and expensive and serve to complicate manipulation. This problem can only be inadequately solved with quick-acting closures for the water management since such quick-acting closures have considerable disadvantages in terms of dead space volume, tightness, pressure loss and costs.
German Published Application 1 439 308 discloses a cooling arrangement wherein a transistor is screwed onto a cooling member that is mounted on a carrier. Cooling channels through which air flows proceed through the cooling member. A printed circuit board is provided on that side of the transistor lying opposite the cooling member.
DE 35 31 729 C2 discloses a cooling device wherein electronic components are arranged on a ceramic plate. For heat elimination, the side of the ceramic plate facing away from the equipment side is provided with pins by which heat is output to the ambient air that flows past. Since the ceramic plate distributes heat well, the temperature difference between the various pins is slight and the heat elimination into the air is efficient.
BRIEF SUMMARY OF THE INVENTION
An object of the present invention is to fashion a cooling device such that the replacement of assemblies is simplified and wherein the components are held at a largely uniform temperature level.
To this end, a cooling device for electrical assemblies is provided for securely mounting on a carrier. The cooling device includes cooling channels for guidance of a coolant stream which, in turn, include at least one flat side for a good thermally conductive connection to at least one electrical assembly. Such connection ensures that the assembly embraces a base plate having both good heat storing capability and thermal conductivity. On such base plate are a plurality of heatemitting components which are arranged in a highly thermally conductive fashion whereby the electrical assembly can be releasably pressed against the flat side of the cooling device.
Additional features and advantages of the present invention are described in, and will be apparent from, the detailed description of the invention and from the drawing.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
FIG. 1 illustrates a sectional view of the cooling device with rectangular tubes;
FIG. 2 illustrates the cooling de
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patent: 5331510 (1994-07-01), Ouchi et al.
Siemens Aktiengesellschaft
Thompson Gregory
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