Cooling device for electric device

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

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Details

357 82, 174 15R, H01L 2342

Patent

active

040362914

ABSTRACT:
A semiconductor device is carried in compressive contact relationship between two vapor cooling containers put in fluid communication with condensers disposed above them through connection tubes respectively. A condensible liquid coolant fully fills each container, and the associated connection tube and partly fills the mating condenser. One auxiliary tube is disposed within each connection tube and has a bent upper end opening in the associated condenser below the liquid surface of the coolant and a lower end opening in the associated cooling container connected thereto.

REFERENCES:
patent: 3609991 (1971-10-01), Chu et al.
patent: 3633665 (1972-01-01), France et al.
patent: 3741292 (1973-06-01), Aakalu et al.

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