Cooling device for components which dissipate large amounts of h

Details Cooling device for components which dissipate large amounts of h Cooling device for components which dissipate large amounts of h

1975-12-15

1977-06-14

Cohan, Alan

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

361385, F28F 308

Patent

active

040291413

ABSTRACT:
A heat sink for components which dissipate large amounts of heat which enables operating temperatures to be held within predetermined limits.
This heat sink consists of a stack of connecting members (34, 38), cooling members (35, 37), "press pack" type components (36) and pressure members (33) which are arranged between two cross-pieces (21, 22) which are held together by ties (24, 25) to form an assembly frame.
The device is applicable in particular to the cooling of power thyristors.

REFERENCES:
patent: 3523215 (1970-08-01), Steinmetz
patent: 3768548 (1973-10-01), Dilay

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