Cooling device for a sputter target and source

Details Cooling device for a sputter target and source Cooling device for a sputter target and source

1988-12-22

1989-12-05

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1434

Patent

active

048850756

ABSTRACT:
A device for cooling a sputter target of a deposition apparatus utilizes an annular shaped member of high thermal conductivity disposed between the cathode and the target electrode. The member is constructed of a base disposed in a corresponding recess in the cathode, or integrally formed therewith, and a member projecting perpendicularly from the base disposed in a corresponding annular shaped recess in the target electrode. One or more members are disposed proximate a source of cooling water applied to the cathode, and at points of greatest power flux in the target electrode. Upon heating, the target electrode expands radially against the members, thereby effecting reduction in the temperature of the target electrode.

REFERENCES:
patent: 3718572 (1973-02-01), Robinson et al.
patent: 3741886 (1973-06-01), Urbanek et al.
patent: 4204936 (1980-05-01), Hartsough
patent: 4517070 (1985-05-01), Kisner
patent: 4668373 (1987-05-01), Rille et al.

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