Cooling device for a liquid-cooled semiconductor power component

Details Cooling device for a liquid-cooled semiconductor power component Cooling device for a liquid-cooled semiconductor power component

1977-03-10

1979-03-06

Myhre, Charles J.

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

174 15R, 2853824, 285386, 357 82, F28F 926, H01L 2504

Patent

active

041425774

ABSTRACT:
Cooling device for a liquid-cooled semiconductor power component of the type having a disc cell formed with two main contact surfaces and electrical and thermal pressure-contacting means therefor in an insulating casing, and having means for liquid cooling including cooling capsules through which liquid flows, the cooling capsules being connected by a clamping device to the two main contact surfaces of the disc cell and being selectively coupable through a liquid-conducting support bar to a plurality of semiconductor power components, including insulating screw connections for connecting union pipes and connecting pipes for the coolant to the cooling capsules with an inclusion of at least partly cold-deformable material of the insulating screw connections, the cooling capsules being connected coolant-wise in series, and including expansion bends formed at least in the connecting pipes between the cooling capsules.

REFERENCES:
patent: 2179293 (1939-11-01), Hein
patent: 2189566 (1940-02-01), Kreidel
patent: 2445702 (1948-07-01), Weyenberg et al.
patent: 3831983 (1974-08-01), Stickler
patent: 4020399 (1977-04-01), Suzuki et al.
patent: 4051509 (1977-09-01), Beriger et al.

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