Cooling device featuring thermoelectric and diamond materials fo

Batteries: thermoelectric and photoelectric – Thermoelectric – Peltier effect device

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

136201, 136204, 136224, 136225, 136237, 136238, 136240, 62 32, 62 33, 62 37, H01L 3504, H01L 3516, H01L 3518, H01L 3530

Patent

active

057124485

ABSTRACT:
A cooling device for lowering the temperature of a heat-dissipating device. The cooling device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with the heat-dissipating device. During operation, heat flows from the heat-dissipating device into the heat-conducting substrate, where it is spread out over a relatively large area. A thermoelectric cooling material (e.g., a Bi.sub.2 Te.sub.3 -based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. Application of electrical power to the thermoelectric material drives the thermoelectric material to pump heat into a second heat-conducting substrate which, in turn, is attached to a heat sink.

REFERENCES:
patent: 3437576 (1969-04-01), Nelson et al.
patent: 3528893 (1970-09-01), Christie et al.
patent: 3635037 (1972-01-01), Hubert
patent: 3859143 (1975-01-01), Krebs
patent: 3988171 (1976-10-01), Miller et al.
patent: 4238957 (1980-12-01), Bailey et al.
patent: 4253515 (1981-03-01), Swiatosz
patent: 4402185 (1983-09-01), Perchak
patent: 4489742 (1984-12-01), Moore et al.
patent: 4704872 (1987-11-01), Jones
patent: 4848090 (1989-07-01), Peters
patent: 4855810 (1989-08-01), Gelb et al.
patent: 5040381 (1991-08-01), Hazen
patent: 5197805 (1993-03-01), Wilson
patent: 5228923 (1993-07-01), Hed
patent: 5298084 (1994-03-01), Van Der Beck et al.
patent: 5415699 (1995-05-01), Harman
patent: 5419780 (1995-05-01), Suski
patent: 5429680 (1995-07-01), Fuschetti
patent: 5457342 (1995-10-01), Herbst, II

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Cooling device featuring thermoelectric and diamond materials fo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling device featuring thermoelectric and diamond materials fo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device featuring thermoelectric and diamond materials fo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-344149

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.