Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-02-21
2006-02-21
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C257S714000, C257S715000, C174S015200, C165S104260
Reexamination Certificate
active
07002802
ABSTRACT:
A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
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Kato Eisaku
Ohmi Motosuke
Tonosaki Minehiro
Chervinsky Boris
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Sony Corporation
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