Cooling device capable of reducing thickness of electronic...

Details Cooling device capable of reducing thickness of electronic... Cooling device capable of reducing thickness of electronic...

2005-06-21

2005-06-21

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S122000, C361S719000, C361S704000, C415S176000

Reexamination Certificate

active

06909604

ABSTRACT:
A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.

REFERENCES:
patent: 5288961 (1994-02-01), Shibuya et al.
patent: 5731953 (1998-03-01), Sakurai
patent: 5810554 (1998-09-01), Yokozawa et al.
patent: 6141218 (2000-10-01), Miyahara
patent: 6665181 (2003-12-01), Tanaka et al.
patent: 6 177567 (1994-06-01), None
patent: 2000 77877 (2000-03-01), None
patent: 2001-284863 (2001-10-01), None

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