Cooling device attached to each surface of electronic parts on a

Details Cooling device attached to each surface of electronic parts on a Cooling device attached to each surface of electronic parts on a

1986-09-19

1987-08-18

Macon, Robert S.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361381, 200289, H02B 100

Patent

active

046881476

ABSTRACT:
A cooling device located between a cooling plate having a first coolant circulating therein, and an electronic part to be cooled, mounted on a printed-wiring board, comprising a hollow part being thermally conductive, having a hollow chamber through which the first coolant circulates, and connected to the cooling plate by a flange part being thermally conductive, a thermal conduction plate attached to a surface of the electronic part and connected to the flange part by a bellows providing a space among the hollow part, the bellows and the thermal conduction plate, and a second liquid coolant filling the space for transferring heat from the thermal conduction plate to the hollow part by a convection current of the second coolant. The second coolant is made of alloy being chemically inactive to the bellows and having a low melting point so as to be liquid at ordinary temperatures.

REFERENCES:
IBM Technical Disclosure Bulletin, Device Cooling, by A. H. Johnson, vol. 20, No. 10, Mar. 1978.
IBM Technical Disclosure Bulletin, Liquid Cooling of a Multichip Module Package, by D. Balderes et al., vol. 20, No. 11A, Apr. 1, 1978.
IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977, pp. 1769-1771, Armonk, N.Y., US; B. T. Clark et al.: "Cooling Device for Multilayer Ceramic Modules".
IBM Technical Disclosure Bulletin, vol. 21, No. 8, Jan. 1979, pp. 3281-3282, Armonk, N.Y., US; Moran: "Self-regulating Evaporative/Conductive Thermal Link".
IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, pp. 3893-3894, Armonk, N.Y., US; Hwang et al.: "Thermal Flexible Piston Module".

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