Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-04-01
2008-04-01
Gandhi, Jayprakash (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S704000, C361S722000, C165S080400, C165S104330, C165S185000
Reexamination Certificate
active
07352581
ABSTRACT:
According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit including a passage through which a coolant circulates, a heat-receiving section having a first portion thermally connected to the first heating element and a second portion thermally connected to the second heating element, a heat-sinking section that dissipates heat received by the heat-receiving section, a first plate member in which is formed a first groove corresponding to the passage, and a second plate member that covers the first groove. The heat-receiving section is formed at least one of the first and second plate members.
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United States Office Action dated Jun. 6, 2007 for U.S. Appl. No 11/473,777, filed Jun. 23, 2006 entitled Cooling Device and Electronic Apparatus.
United States Office Action dated Sep. 19, 2007 for U.S. Appl. No. 11/473,777, filed Jun. 23, 2006 entitled Cooling Device and Electronic Apparatus.
United States Office Action dated Jun. 5, 2007 for U.S. Appl. No. 11/474,178, filed Jun. 23, 2006 entitled Cooling Device and Electronic Apparatus.
United States Office Action dated Sep. 19, 2007 for U.S. Appl. No. 11/474,178, filed Jun. 23, 2006 entitled Cooling Device and Electronic Apparatus.
Blakely & Sokoloff, Taylor & Zafman
Gandhi Jayprakash
Hoffberg Robert J
Kabushiki Kaisha Toshiba
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