Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-04-19
2011-04-19
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679470, C361S679490, C361S697000, C165S121000, C165S122000
Reexamination Certificate
active
07929302
ABSTRACT:
A cooling device for dissipating heat for an electronic device includes a shell to absorb heat generating from a heat generating element in the electronic device, and a number of fins. The shell bounds a heat exchanging space and defines an air intake and an air outlet. The number of fins extends into the heat exchanging space. The shell guides air outside the shell to enter into the shell through the air intake and to exit from the shell through the air outlet after exchanging heat in the heat exchanging space.
REFERENCES:
patent: 5019880 (1991-05-01), Higgins, III
patent: 5132780 (1992-07-01), Higgins, III
patent: 5494098 (1996-02-01), Morosas
patent: 5504650 (1996-04-01), Katsui et al.
patent: 5650912 (1997-07-01), Katsui et al.
patent: 5898568 (1999-04-01), Cheng
patent: 6104607 (2000-08-01), Behl
patent: 6118658 (2000-09-01), Nakase
patent: 6137680 (2000-10-01), Kodaira et al.
patent: 6233149 (2001-05-01), Bailey et al.
patent: 6570760 (2003-05-01), Wang
patent: 6659169 (2003-12-01), Lopatinsky et al.
patent: 6684942 (2004-02-01), Song et al.
patent: 6700781 (2004-03-01), Chia-Kuan et al.
patent: 6724624 (2004-04-01), Dodson
patent: 6822856 (2004-11-01), Fujiwara
patent: 6885555 (2005-04-01), Greco
patent: 6927979 (2005-08-01), Watanabe et al.
patent: 7165604 (2007-01-01), Huang
patent: 7324339 (2008-01-01), Foster et al.
patent: 7385816 (2008-06-01), Foster et al.
patent: 7391612 (2008-06-01), Foster et al.
patent: 7532474 (2009-05-01), Xue et al.
patent: 7554805 (2009-06-01), Liu et al.
patent: 2009/0026813 (2009-01-01), Lofy
Datskovskiy Michael V
Hon Hai Precision Industry Co. Ltd.
Ma Zhigang
LandOfFree
Cooling device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2619245