Cooling cover for RF power devices

Details Cooling cover for RF power devices Cooling cover for RF power devices

1993-04-09

1995-06-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361763, 361807, 174 163, 165185, 257720, H05K 118

Patent

active

054285046

ABSTRACT:
A cooling cover for an RF power amplifier device having a mounting support, a first lead, and a heat generating die mounted on the first lead. The cooling cover is comprised of a body of a thermally conductive material and having a first surface and a second surface. A layer of thermally conductive and electrical non-conductive material is deposited upon the second surface of the cooling cover. When the cover is coupled to the mounting support, the first surface is in contact with the mounting support and the second surface is in contact with the first lead thereby providing a low resistance heat path between the heat generating die and mounting support.

REFERENCES:
patent: 4396939 (1983-08-01), McIver et al.
patent: 4554613 (1985-11-01), Kaufman
patent: 4607276 (1986-08-01), Butt
patent: 4724514 (1988-02-01), Kaufman
patent: 4758927 (1988-07-01), Berg
patent: 5057909 (1991-10-01), Mok et al.
patent: 5113315 (1992-05-01), Capp et al.

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