Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-16
2009-10-27
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C165S080400, C165S104330
Reexamination Certificate
active
07609518
ABSTRACT:
A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the interior of the container, and a serial data connection is provided between the processing board and the exterior of the container.
REFERENCES:
patent: 4704658 (1987-11-01), Yokouchi et al.
patent: 4764845 (1988-08-01), Artus
patent: 5262921 (1993-11-01), Lamers
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5349499 (1994-09-01), Yamada et al.
patent: 5373417 (1994-12-01), Barrett
patent: 5569950 (1996-10-01), Lewis et al.
patent: 6123145 (2000-09-01), Glezer et al.
patent: 6173577 (2001-01-01), Gold
patent: 6175501 (2001-01-01), Bortolini et al.
patent: 6193905 (2001-02-01), Yamada et al.
patent: 6992888 (2006-01-01), Iyer
patent: 7092254 (2006-08-01), Monsef et al.
patent: 7161804 (2007-01-01), Oyamada
patent: 7187265 (2007-03-01), Senogles et al.
patent: 7200008 (2007-04-01), Bhugra
patent: 7211742 (2007-05-01), Moore et al.
patent: 7257003 (2007-08-01), Ono
patent: 7277282 (2007-10-01), Tate
patent: 7307841 (2007-12-01), Berlin et al.
patent: 20 2005 002390 (2005-07-01), None
patent: 0369827 (1990-05-01), None
patent: 0524757 (1993-01-01), None
patent: 888944 (1962-02-01), None
patent: 1064907 (1967-04-01), None
patent: 1126180 (1968-09-01), None
patent: 1431560 (1976-04-01), None
patent: 2235334 (1991-02-01), None
patent: 9/293813 (1997-11-01), None
patent: WO 2006/133429 (2006-12-01), None
Bown Simon Kevin
Hopton Peter John
Chervinsky Boris L
Creighton Wray James
Iceotope Limited
Narasimhan Meera P.
LandOfFree
Cooling computer components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling computer components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling computer components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4059604