Cooling cap method and apparatus for tab packaged integrated cir

Details Cooling cap method and apparatus for tab packaged integrated cir Cooling cap method and apparatus for tab packaged integrated cir

1996-02-22

1998-09-08

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165 803, 165185, 174 163, 257713, 257718, H05K 720

Patent

active

058054189

ABSTRACT:
The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap. Risers, which may be either integral to the cooling cap or separate elements, are used to lift the cooling cap above the surface of the circuit board so as to provide space for the component.

REFERENCES:
patent: 4321423 (1982-03-01), Johnson et al.
patent: 4593342 (1986-06-01), Lindsay
patent: 4849856 (1989-07-01), Funari et al.
patent: 5014904 (1991-05-01), Morton
patent: 5410451 (1995-04-01), Hawthorne et al.
IBM Tech. Disclosure Bulletin "Film On Metal Leaded Chip Carrier" vol. 31, No. 1, Jun. 1988 pp. 2-3 (361/719).

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