Cooling by use of multiple parallel convective surfaces

Details Cooling by use of multiple parallel convective surfaces Cooling by use of multiple parallel convective surfaces

1991-09-04

1993-07-20

Rivell, John

Heat exchange

With retainer for removable article

Electrical component

165142, 165908, 361382, 361385, 257714, F28D 712, H05K 720

Patent

active

052285022

ABSTRACT:
An improved electronic cooling module having thermally optimized and fully integrated vertical water channels located between pistons. The water channels include directed jets matched to the piston localized performance and an inner tube locally attached to the channel hole providing parallel convective surfaces.

REFERENCES:
patent: 2273257 (1942-02-01), Gardner
patent: 4072189 (1978-02-01), Chaix et al.
patent: 4226281 (1980-11-01), Chu
patent: 4452233 (1984-06-01), Goodman, Jr. et al.
patent: 4574877 (1986-03-01), Klein
patent: 4740866 (1988-04-01), Kajiwara et al.
patent: 4750086 (1988-06-01), Mittal
patent: 4759403 (1988-07-01), Flint et al.
patent: 4882654 (1989-11-01), Nelson et al.
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 4977444 (1990-12-01), Nakajima et al.
Pacuzzo, A. L. et al., "Integrated Circuit Module Package Cooling Structure", IBM Tech. Discl. Bull., vol. 20, No. 10, Mar. 1978, pp. 3898-3899.
Research Disclosure, Mar. 1990, No. 311 entitled "Annulus-Convection . . . Cooling".
IBM TDB, vol. 31, No. 5, Oct. 1988, entitled "Multi-Chip Package . . . Within Its Pins" pp. 141-142.
IBM TDB, vol. 20, No. 11A, Apr. 1978, entitled "Integrated Module Heat Exchanger" by Antonette et al., p. 4498.

Affiliated with

Also associated with

Rating

Cooling by use of multiple parallel convective surfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling by use of multiple parallel convective surfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling by use of multiple parallel convective surfaces will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1754712