Cooling assembly with impingement cooled heat sink

Details Cooling assembly with impingement cooled heat sink Cooling assembly with impingement cooled heat sink

2007-05-08

2007-05-08

Duong, Tho (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S104330

Reexamination Certificate

active

11080012

ABSTRACT:
The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto the fins and is disposed above the base plate and below the top extremity of the fins. The flow of cooling fluid is discharged from the nozzle adjacent the base plate and then flows upwardly through the fins to remove the heat from the base plate before removing any heat from the fins.

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patent: 6105373 (2000-08-01), Watanabe et al.
patent: 6422307 (2002-07-01), Bhatti

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