Heat exchange – With impeller or conveyor moving exchange material – Mechanical gas pump
Patent
1993-09-30
1994-08-09
Fox, John C.
Heat exchange
With impeller or conveyor moving exchange material
Mechanical gas pump
165 803, 361697, 257722, H05K 720
Patent
active
053357221
ABSTRACT:
A cooling assembly includes a fin, a fan retained above the fin, and a housing. The fin includes a bottom surface for contacting an upper surface of the integrated circuit and an upper surface from which a plurality of ridges extend, each two adjacent ridges defining a channel therebetween. A plurality of venting openings are formed in a top wall of the hollow housing. A plurality of snapping members project downwardly from two mutually facing side walls of the hollow housing and each of which having a distal flexible snapping end for releasably engaging with an underside of the integrated circuit. A pair of ribs are formed in an upper section of each of two mutually facing inner sides of the side walls of the hollow housing, the distance between opposite ribs being equal to a width of the integrated circuit. A plurality of oblique flexible pieces extend from an inner side of the top wall of the hollow housing. A groove is formed in an outer side of each of two outermost ridges and extends along a longitudinal direction of the ridges, and a protrusion is formed in a lower section of each of two mutually facing inner sides of the side walls of the hollow housing for engaging with an associated groove.
REFERENCES:
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4682268 (1987-07-01), Ohano et al.
patent: 4804172 (1989-02-01), Soboloosby et al.
patent: 5036384 (1991-07-01), Urugawa
Fox John C.
Global Win Technology Co., Ltd
Huei Bin Enterprise Corp.
LandOfFree
Cooling assembly for an integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling assembly for an integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling assembly for an integrated circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-210226