Cooling assembly

Details Cooling assembly Cooling assembly

2005-06-23

2009-06-09

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S700000, C165S080200, C165S080300, C165S080500

Reexamination Certificate

active

07545646

ABSTRACT:
A cooling assembly and method of cooling a heat-generating electronic component on a circuit board. A heat collector collects heat from the electronic component. A heat pipe transfers the heat to a location remote from the electronic component. A heat sink is mounted to the circuit board at the distant location. The heat sink has at least one groove formed on an underside thereof. The heat sink is mounted so that is overlies the heat pipe and the heat pipe is introduced into the groove, thereby securing the heat pipe between the heat sink and the circuit board.

REFERENCES:
patent: 6137681 (2000-10-01), Lu
patent: 6351382 (2002-02-01), Nakanishi et al.
patent: 6650540 (2003-11-01), Ishikawa
patent: 6661660 (2003-12-01), Prasher et al.
patent: 7047640 (2006-05-01), Lee et al.
patent: 2004022786 (2004-01-01), None

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