Cooling arrangement for flat semiconductor components

Details Cooling arrangement for flat semiconductor components Cooling arrangement for flat semiconductor components

1974-07-25

1976-03-09

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165122, 317100, 357 82, F28D 1500, H01L 300, H01L 500

Patent

active

039425860

ABSTRACT:
An improved cooling arrangement for flat semiconductor components such as disc-type thyristors in which the semiconductor component is clamped between two solid cooling elements with each cooling element carrying at least one heat pipe with attached cooling fins and in which a plurality of such cooling arrangements rotationally displaced are combined in a column-like cooling stack to achieve equally good cooling for all heat pipes.

REFERENCES:
patent: 2169109 (1939-08-01), Muller
patent: 3011105 (1961-11-01), Le Blanc
patent: 3653433 (1972-04-01), Scharli
patent: 3792318 (1974-02-01), Fries et al.

Affiliated with

Also associated with

Rating

Cooling arrangement for flat semiconductor components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling arrangement for flat semiconductor components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling arrangement for flat semiconductor components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-826605