Cooling arrangement

Details Cooling arrangement Cooling arrangement

2008-09-23

2008-09-23

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S698000, C361S720000

Reexamination Certificate

active

11262295

ABSTRACT:
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, to be cooled, on the respective printed circuit board or the plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The printed circuit board or the plug-in module has an area for fitting electronic components and a coupling area for coupling the feed line with the component feed line and for coupling the return-flow line with the component return-flow line.

REFERENCES:
patent: 4493010 (1985-01-01), Morrison et al.
patent: 4962444 (1990-10-01), Niggemann
patent: 5285347 (1994-02-01), Fox et al.
patent: 5365749 (1994-11-01), Porter
patent: 5740018 (1998-04-01), Rumbut, Jr.
patent: 6052285 (2000-04-01), Hileman
patent: 6536510 (2003-03-01), Khrustalev et al.
patent: 6644058 (2003-11-01), Bash et al.
patent: 6807056 (2004-10-01), Kondo et al.
patent: 6836407 (2004-12-01), Faneuf et al.
patent: 6999316 (2006-02-01), Hamman
patent: 7010930 (2006-03-01), Arik et al.
patent: 7012807 (2006-03-01), Chu et al.
patent: 7187549 (2007-03-01), Teneketges et al.
patent: 2003/0000721 (2003-01-01), Garner
patent: 2003/0010477 (2003-01-01), Khrustalev et al.
patent: 2003/0057546 (2003-03-01), Memory et al.
patent: 2004/0008483 (2004-01-01), Cheon
patent: 2004/0037045 (2004-02-01), Phillips et al.
patent: 2004/0163797 (2004-08-01), Cosley et al.
patent: 2004/0221604 (2004-11-01), Ota et al.
patent: 2006/0002080 (2006-01-01), Leija et al.
patent: 2006/0067047 (2006-03-01), Pfahnl
patent: 1148 040 (2004-08-01), None

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