Cooling arrangement

Details Cooling arrangement Cooling arrangement

2005-10-28

2009-11-10

Jiang, Chen-Wen (Department: 3744)

Refrigeration

Structural installation

With electrical component cooling

C361S698000, C361S699000, C165S080400, C257S714000

Reexamination Certificate

active

07614247

ABSTRACT:
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, which is to be cooled, on the respective printed circuit board or plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The component feed line and the component return-flow line have coupling elements attached at ends of the respective printed circuit board or plug-in module which, together with the counter coupling elements of the feed line and the return-flow line attached at the end of the housing, form a coupling connection, which is releasable.

REFERENCES:
patent: 6313990 (2001-11-01), Cheon
patent: 6807056 (2004-10-01), Kondo et al.
patent: 7428151 (2008-09-01), Sonnabend et al.
patent: 2004/0221604 (2004-11-01), Ota et al.
patent: 1 448 040 (2004-08-01), None

Affiliated with

Also associated with

Rating

Cooling arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling arrangement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4137686