Cooling apparatus using boiling and condensing refrigerant

Details Cooling apparatus using boiling and condensing refrigerant Cooling apparatus using boiling and condensing refrigerant

1997-03-05

1998-11-10

Lazarus, Ira S.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165153, 257715, 361700, F28D 1500

Patent

active

058329897

ABSTRACT:
An object of the present invention is to provide a cooling apparatus using a boiling and condensing refrigerant which can be economically manufactured. Another object is to improve reliability of soldering. A refrigerant tank, on which hot objects to be cooled is mounted, is connected to a radiator for condensing the vaporized refrigerant through a coupler made of two plates bonded together by soldering. The coupler connecting the tank and the radiator can be made easily and economically even if it has a complex shape, because the coupler is composed of two stamped plates. To bond two plates together by soldering process, it is necessary to secure an air-tightness and a high reliability. Improved configurations of the coupler and ways of fastening the two plates effectively are provided in the present invention.

REFERENCES:
patent: 3989099 (1976-11-01), Hosono et al.
patent: 4023616 (1977-05-01), Scherbaum
patent: 4330033 (1982-05-01), Okada et al.
patent: 4705102 (1987-11-01), Kanda et al.
patent: 4821531 (1989-04-01), Yamauchi et al.
patent: 4862321 (1989-08-01), Saitoo et al.
patent: 4899211 (1990-02-01), Dumoulin
patent: 5168919 (1992-12-01), Berenholz et al.
patent: 5479985 (1996-01-01), Yamamoto et al.

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