Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-01-06
2008-03-18
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C361S715000, C361S719000, C361S720000
Reexamination Certificate
active
07345877
ABSTRACT:
A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.
REFERENCES:
patent: 3651865 (1972-03-01), Feldmanis
patent: 4921041 (1990-05-01), Akachi
patent: 5283715 (1994-02-01), Carlsten et al.
patent: 5697428 (1997-12-01), Akachi
patent: 5842514 (1998-12-01), Zapach et al.
patent: 6008987 (1999-12-01), Gale et al.
patent: 6055157 (2000-04-01), Bartilson
patent: 6104611 (2000-08-01), Glover et al.
patent: 6388882 (2002-05-01), Hoover et al.
patent: 6490159 (2002-12-01), Goenka et al.
patent: 6643132 (2003-11-01), Faneuf et al.
patent: 6672373 (2004-01-01), Smyrnov
patent: 6674643 (2004-01-01), Centola et al.
patent: 6788537 (2004-09-01), Saita et al.
patent: 6804117 (2004-10-01), Phillips et al.
patent: 6972365 (2005-12-01), Garner
patent: 7130193 (2006-10-01), Hirafuji et al.
patent: 7190582 (2007-03-01), Tonosaki et al.
patent: 7193850 (2007-03-01), Pal
patent: 2003/0037910 (2003-02-01), Smyrnov
patent: 2005/0174735 (2005-08-01), Mankaruse et al.
patent: 1 684 252 (2005-10-01), None
patent: 1 363 481 (2003-11-01), None
patent: 2004 003816 (2004-01-01), None
patent: WO 02/102124 (2002-12-01), None
Takahiro Katoh, Kiyoo Amako, Hisateru Akachi; Application for New Heat Conductor for Avionics Cooling, 1999.
Copy of International Search Report and Written Opinion for PCT/US2005/040595 filed Nov. 9, 2005.
Database Inspec the Institution of Electrical Engineers, Stevenage, GB; 2004, Karimi G et al: “Review and Assessment of Pulsating Heat Pipe Mechanism for High Heat Flux Electronic Cooling”; XP002409418.
Asfia Julie F.
Cai Qingjun
Chen Chung-Lung
Alston & Bird LLP
The Boeing Company
Thompson Gregory D
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