Cooling apparatus of electronic device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361689, 361704, 361765, 174 163, 165 804, H05K 720

Patent

active

053654021

ABSTRACT:
A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

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patent: 5055914 (1991-10-01), Shimizu et al.

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