Metal working – Method of mechanical manufacture – Heat exchanger or boiler making
Reexamination Certificate
2006-01-24
2006-01-24
Omgba, Essama (Department: 3726)
Metal working
Method of mechanical manufacture
Heat exchanger or boiler making
C029S890032, C029S890046, C029S890050, C165S104330, C165S108000
Reexamination Certificate
active
06988315
ABSTRACT:
A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
REFERENCES:
patent: 3528494 (1970-09-01), Levedahl
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4196504 (1980-04-01), Eastman
patent: 4279294 (1981-07-01), Fitzpatrick et al.
patent: 4280519 (1981-07-01), Chapman
patent: 4381032 (1983-04-01), Cutchaw
patent: 4470450 (1984-09-01), Bizzell et al.
patent: 4503906 (1985-03-01), Andres et al.
patent: 4550774 (1985-11-01), Andres et al.
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4640347 (1987-02-01), Grover et al.
patent: 4675783 (1987-06-01), Murase et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4830100 (1989-05-01), Kato et al.
patent: 4854377 (1989-08-01), Komoto et al.
patent: 4880052 (1989-11-01), Meyer, IV et al.
patent: 4880053 (1989-11-01), Sheyman
patent: 4884630 (1989-12-01), Nelson et al.
patent: 4896716 (1990-01-01), Sotani et al.
patent: 4909315 (1990-03-01), Nelson et al.
patent: 4921041 (1990-05-01), Akachi
patent: 4982274 (1991-01-01), Murase et al.
patent: 5002122 (1991-03-01), Sarraf et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5036384 (1991-07-01), Umezawa
patent: 5044429 (1991-09-01), Sakaya et al.
patent: 5054296 (1991-10-01), Sotani et al.
patent: 5069274 (1991-12-01), Haslett et al.
patent: 5076351 (1991-12-01), Munekawa et al.
patent: 5084966 (1992-02-01), Murase
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5139546 (1992-08-01), Novobilski
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5168921 (1992-12-01), Meyer, IV
patent: 5186252 (1993-02-01), Nishizawa et al.
patent: 5199487 (1993-04-01), DiFrancesco et al.
patent: 5283464 (1994-02-01), Murase
patent: 5283715 (1994-02-01), Carlsten et al.
patent: 5285347 (1994-02-01), Fox et al.
patent: 5314010 (1994-05-01), Sakaya et al.
patent: 5316077 (1994-05-01), Reichard
patent: 5336128 (1994-08-01), Birdsong
patent: 5342189 (1994-08-01), Inamura et al.
patent: 5353639 (1994-10-01), Brookins et al.
patent: 5355942 (1994-10-01), Conte
patent: 5388635 (1995-02-01), Gruber et al.
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5535816 (1996-07-01), Ishida
patent: 5555622 (1996-09-01), Yamamoto et al.
patent: 5567493 (1996-10-01), Imai et al.
patent: 5598632 (1997-02-01), Camarda et al.
patent: 5615086 (1997-03-01), Collins et al.
patent: 5636684 (1997-06-01), Teytu et al.
patent: 5642775 (1997-07-01), Akachi
patent: 5651414 (1997-07-01), Suzuki et al.
patent: 5660229 (1997-08-01), Lee et al.
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5682748 (1997-11-01), DeVilbiss et al.
patent: 5689957 (1997-11-01), DeVilbiss et al.
patent: 5690849 (1997-11-01), DeVilbiss et al.
patent: 5692558 (1997-12-01), Hamilton et al.
patent: 5697428 (1997-12-01), Akachi
patent: 5711155 (1998-01-01), DeVilbiss et al.
patent: 5727619 (1998-03-01), Yao et al.
patent: 5737186 (1998-04-01), Fuesser et al.
patent: 5890371 (1999-04-01), Rajasubramanian et al.
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 5901040 (1999-05-01), Cromwell et al.
patent: 5960866 (1999-10-01), Kimura et al.
patent: 5989285 (1999-11-01), DeVilbiss et al.
patent: 6032726 (2000-03-01), Wright et al.
patent: 6041850 (2000-03-01), Esser et al.
patent: 6058712 (2000-05-01), Rajasubramanian et al.
patent: 6072697 (2000-06-01), Garcia-Ortiz
patent: 6101715 (2000-08-01), Fuesser et al.
patent: 6148906 (2000-11-01), Li et al.
patent: 6293333 (2001-09-01), Ponnappan et al.
patent: 6302192 (2001-10-01), Dussinger et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6397935 (2002-06-01), Yamamoto et al.
patent: 6462949 (2002-10-01), Parish, IV et al.
patent: 6523259 (2003-02-01), Pinneo
patent: 6679316 (2004-01-01), Lin et al.
patent: 6698502 (2004-03-01), Lee
patent: 6745825 (2004-06-01), Nakamura et al.
patent: 6795310 (2004-09-01), Ghosh
patent: 6810946 (2004-11-01), Hoang
patent: 6820684 (2004-11-01), Chu et al.
patent: 6828675 (2004-12-01), Memory et al.
patent: 6834712 (2004-12-01), Parish et al.
patent: 2002/0189793 (2002-12-01), Noda et al.
patent: 2004/0099407 (2004-05-01), Parish et al.
patent: 2004/0112572 (2004-06-01), Moon et al.
patent: 2004/0177947 (2004-09-01), Krassowski et al.
patent: 2005/0006061 (2005-01-01), Quisenberry et al.
patent: 2005/0056403 (2005-03-01), Norlin et al.
patent: 1284506 (1968-12-01), None
patent: 3117758 (1982-01-01), None
patent: 8512617 (1985-09-01), None
patent: 19849919 (1999-05-01), None
patent: 334209 (1930-08-01), None
patent: 1402509 (1975-08-01), None
patent: 2128319 (1984-04-01), None
patent: 2128319 (1984-04-01), None
patent: 2128320 (1984-04-01), None
patent: 2128320 (1984-04-01), None
patent: 53136749 (1978-11-01), None
patent: 63115351 (1988-05-01), None
patent: 6291481 (1994-10-01), None
patent: 589531 (1978-01-01), None
patent: 1476297 (1989-04-01), None
patent: WO 91/06958 (1991-05-01), None
patent: WO-95/26125 (1995-09-01), None
patent: WO-98/020260 (1998-01-01), None
patent: WO 99/42781 (1999-08-01), None
patent: WO 00/70288 (2000-11-01), None
patent: WO 01/03484 (2001-01-01), None
Thermalex, Inc. Brochure, 2758 Gunter Park Drive West, Montgomery, AL, no date.
“Furukawa Electric Heat Planar”, undated material from Aug. 1999 trade show marketed by Furu Kawa Electric North America, Inc.
Andre Ali et al.; “Advanced Heat Pipe Thermal Solutions for Higher Power Notebook Computers”; Intel Corporation, Santa Clara, CA 1999; Thermacore, Inc. Lancaster, PA 1999; 6 pages.
“Gore's POLARCHIP Thermal Interface Materials . . . Bridge the Gap Between Hot PCBs and Cool Heat Sinks.”; W.L. Gore and Associates, Inc. 2000; 1 page.
“Thermal Management Components To Fill Virtually Any Gap Configuration”; Stockewell Rubber Company; Nov. 2001.
DeVilbiss Roger S.
Parish IV Overton L.
Jenkens & Gilchrist P.C.
Omgba Essama
Thermotek, Inc.
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