Cooling apparatus having low profile extrusion

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S104260

Reexamination Certificate

active

07322400

ABSTRACT:
A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

REFERENCES:
patent: 3528494 (1970-09-01), Levedahl
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4196504 (1980-04-01), Eastman
patent: 4279294 (1981-07-01), Fitzpatrick et al.
patent: 4280519 (1981-07-01), Chapman
patent: 4381032 (1983-04-01), Cutchaw
patent: 4470450 (1984-09-01), Bizzell et al.
patent: 4503906 (1985-03-01), Andres et al.
patent: 4550774 (1985-11-01), Andres et al.
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4640347 (1987-02-01), Grover et al.
patent: 4675783 (1987-06-01), Murase et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4830100 (1989-05-01), Kato et al.
patent: 4854377 (1989-08-01), Komoto et al.
patent: 4880052 (1989-11-01), Meyer, IV et al.
patent: 4880053 (1989-11-01), Sheyman
patent: 4884630 (1989-12-01), Nelson et al.
patent: 4896716 (1990-01-01), Sotani et al.
patent: 4909315 (1990-03-01), Nelson et al.
patent: 4921041 (1990-05-01), Akachi
patent: 4982274 (1991-01-01), Murase et al.
patent: 5002122 (1991-03-01), Sarraf et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5036384 (1991-07-01), Umezawa
patent: 5044429 (1991-09-01), Sakaya et al.
patent: 5054296 (1991-10-01), Sotani et al.
patent: 5069274 (1991-12-01), Haslett et al.
patent: 5076351 (1991-12-01), Munekawa et al.
patent: 5084966 (1992-02-01), Murase
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5133492 (1992-07-01), Wohrstein et al.
patent: 5139546 (1992-08-01), Novobilski
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5168921 (1992-12-01), Meyer, IV
patent: 5186252 (1993-02-01), Nishizawa et al.
patent: 5199487 (1993-04-01), DiFrancesco et al.
patent: 5203399 (1993-04-01), Koizumi
patent: 5283464 (1994-02-01), Murase
patent: 5283715 (1994-02-01), Carlsten et al.
patent: 5285347 (1994-02-01), Fox et al.
patent: 5314010 (1994-05-01), Sakaya et al.
patent: 5316077 (1994-05-01), Reichard
patent: 5336128 (1994-08-01), Birdsong
patent: 5342189 (1994-08-01), Inamura et al.
patent: 5353639 (1994-10-01), Brookins et al.
patent: 5355942 (1994-10-01), Conte
patent: 5388635 (1995-02-01), Gruber et al.
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5535816 (1996-07-01), Ishida
patent: 5544698 (1996-08-01), Paulman
patent: 5555622 (1996-09-01), Yamamoto et al.
patent: 5567493 (1996-10-01), Imai et al.
patent: 5598632 (1997-02-01), Camarda et al.
patent: 5615086 (1997-03-01), Collins et al.
patent: 5636684 (1997-06-01), Teytu et al.
patent: 5642775 (1997-07-01), Akachi
patent: 5651414 (1997-07-01), Suzuki et al.
patent: 5653111 (1997-08-01), Attey et al.
patent: 5660229 (1997-08-01), Lee et al.
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5682748 (1997-11-01), DeVilbiss et al.
patent: 5689957 (1997-11-01), DeVilbiss et al.
patent: 5690849 (1997-11-01), DeVilbiss et al.
patent: 5692558 (1997-12-01), Hamilton et al.
patent: 5697428 (1997-12-01), Akachi
patent: 5711155 (1998-01-01), DeVilbiss et al.
patent: 5727619 (1998-03-01), Yao et al.
patent: 5731954 (1998-03-01), Cheon
patent: 5737186 (1998-04-01), Fuesser et al.
patent: 5890371 (1999-04-01), Rajasubramanian et al.
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 5901040 (1999-05-01), Cromwell et al.
patent: 5960866 (1999-10-01), Kimura et al.
patent: 5989285 (1999-11-01), DeVilbiss et al.
patent: 6032726 (2000-03-01), Wright et al.
patent: 6041850 (2000-03-01), Esser et al.
patent: 6058712 (2000-05-01), Rajasubramanian et al.
patent: 6072697 (2000-06-01), Garcia-Ortiz
patent: 6101715 (2000-08-01), Fuesser et al.
patent: 6148906 (2000-11-01), Li et al.
patent: 6293333 (2001-09-01), Ponnappan et al.
patent: 6302192 (2001-10-01), Dussinger et al.
patent: 6394175 (2002-05-01), Chen et al.
patent: 6397935 (2002-06-01), Yamamoto et al.
patent: 6457515 (2002-10-01), Vafai et al.
patent: 6462949 (2002-10-01), Parish, IV et al.
patent: 6523259 (2003-02-01), Pinneo
patent: 6647625 (2003-11-01), Wang et al.
patent: 6679316 (2004-01-01), Lin et al.
patent: 6698502 (2004-03-01), Lee
patent: 6745825 (2004-06-01), Nakamura et al.
patent: 6795310 (2004-09-01), Ghosh
patent: 6810946 (2004-11-01), Hoang
patent: 6820684 (2004-11-01), Chu et al.
patent: 6828675 (2004-12-01), Memory et al.
patent: 6834712 (2004-12-01), Parish et al.
patent: 6935409 (2005-08-01), Parish IV et al.
patent: 2002/0189793 (2002-12-01), Noda et al.
patent: 2003/0089487 (2003-05-01), Parish IV et al.
patent: 2003/0127215 (2003-07-01), Parish IV et al.
patent: 2004/0099407 (2004-05-01), Parish IV et al.
patent: 2004/0112572 (2004-06-01), Moon et al.
patent: 2004/0177947 (2004-09-01), Krassowski et al.
patent: 2005/0006061 (2005-01-01), Quisenberry et al.
patent: 2005/0039887 (2005-02-01), Parish IV et al.
patent: 2005/0056403 (2005-03-01), Norlin et al.
patent: 1284506 (1968-12-01), None
patent: 3117758 (1982-01-01), None
patent: 8512617 (1985-09-01), None
patent: 19849919 (1999-05-01), None
patent: 334209 (1930-08-01), None
patent: 1402509 (1978-08-01), None
patent: 2128319 (1984-04-01), None
patent: 2128320 (1984-04-01), None
patent: 53136749 (1978-11-01), None
patent: 63115251 (1988-05-01), None
patent: 06291481 (1994-10-01), None
patent: 1476297 (1989-04-01), None
patent: 589531 (1994-10-01), None
patent: WO-91/06958 (1991-05-01), None
patent: WO-95/26125 (1995-09-01), None
patent: WO-98/02060 (1998-01-01), None
patent: WO99/42781 (1999-08-01), None
patent: WO 00/70288 (2000-11-01), None
patent: WO 01/03484 (2001-01-01), None
Thermalex, Inc. Brochure, 2758 Gunter Park Drive West, Montgomery, AL, no date.
“Furukawa Electric Heat Planar”, undated material from Aug. 1999 trade show marketed by Furu Kawa Electric North America, Inc.
Andre Ali et al.; “Advanced Heat Pipe Thermal Solutions for Higher Power Notebook Computers”; Intel Corporation, Santa Clara, CA 1999; Thermacore, Inc. Lancaster, PA 1999; 6 pages.
“Gore's Polarchip Thermal Interface Materials . . . Bridge the Gap Between Hot PCBs and Cool Sinks.”; W.L. Gore and Associates, Inc. 2000; 1 page.
“Thermal Management Components to Fill Virtually any Gap Configuration”; Stockwell Rubber Company; Nov. 2001.
U.S. Appl. No. 10/998,198, filed Nov. 26, 2004, Quisenberry et al.
U.S. Appl. No. 10/998,199, filed Nov. 26, 2004, Parish IV et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Cooling apparatus having low profile extrusion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling apparatus having low profile extrusion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling apparatus having low profile extrusion will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3964254

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.