Cooling apparatus having low profile extrusion

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C165S080400, C165S104210, C165S104260, C165S104330

Reexamination Certificate

active

06935409

ABSTRACT:
A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.

REFERENCES:
patent: 3528494 (1970-09-01), Levedahl
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4196504 (1980-04-01), Eastman
patent: 4381032 (1983-04-01), Cutchaw
patent: 4470450 (1984-09-01), Bizzell et al.
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4640347 (1987-02-01), Grover et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4830100 (1989-05-01), Kato et al.
patent: 4854377 (1989-08-01), Komoto et al.
patent: 4880052 (1989-11-01), Meyer, IV et al.
patent: 4880053 (1989-11-01), Sheyman
patent: 4884630 (1989-12-01), Nelson et al.
patent: 4896716 (1990-01-01), Sotani et al.
patent: 4909315 (1990-03-01), Nelson et al.
patent: 4982274 (1991-01-01), Murase et al.
patent: 5002122 (1991-03-01), Sarraf et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5036384 (1991-07-01), Umezawa
patent: 5054296 (1991-10-01), Sotani et al.
patent: 5069274 (1991-12-01), Haslett et al.
patent: 5084966 (1992-02-01), Murase
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5186252 (1993-02-01), Nishizawa et al.
patent: 5199487 (1993-04-01), DiFrancesco et al.
patent: 5283464 (1994-02-01), Murase
patent: 5285347 (1994-02-01), Fox et al.
patent: 5316077 (1994-05-01), Reichard
patent: 5342189 (1994-08-01), Inamura et al.
patent: 5353639 (1994-10-01), Brookins et al.
patent: 5388635 (1995-02-01), Gruber et al.
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5555622 (1996-09-01), Yamamoto et al.
patent: 5567493 (1996-10-01), Imai et al.
patent: 5598632 (1997-02-01), Camarda et al.
patent: 5615086 (1997-03-01), Collins et al.
patent: 5636684 (1997-06-01), Teytu et al.
patent: 5642775 (1997-07-01), Akachi
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5692558 (1997-12-01), Hamilton et al.
patent: 5737186 (1998-04-01), Fuesser et al.
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 5960866 (1999-10-01), Kimura et al.
patent: 6032726 (2000-03-01), Wright et al.
patent: 6101715 (2000-08-01), Fuesser et al.
patent: 6293333 (2001-09-01), Ponnappan et al.
patent: 6302192 (2001-10-01), Dussinger et al.
patent: 6397935 (2002-06-01), Yamamoto et al.
patent: 6523259 (2003-02-01), Pinneo
patent: 6698502 (2004-03-01), Lee
patent: 6745825 (2004-06-01), Nakamura et al.
patent: 6810946 (2004-11-01), Hoang
patent: 6820684 (2004-11-01), Chu et al.
patent: 6828675 (2004-12-01), Memory et al.
patent: 2128319 (1984-04-01), None
patent: 2128320 (1984-04-01), None
patent: WO 91/06958 (1991-05-01), None
patent: WO 99/42781 (1999-08-01), None
patent: WO 00/70288 (2000-11-01), None
patent: WO 01/03484 (2001-01-01), None

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