Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-01-31
2004-11-16
Thompson, Gregory D. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S185000, C361S706000, C361S710000, C361S715000, C361S721000
Reexamination Certificate
active
06819562
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to apparatus for cooling electronic components, and more particularly to apparatus for cooling electronic components that are mounted in a multi-layer or stacked arrangement.
BACKGROUND
It would be desirable to stack printed circuit boards together in a multi-layer arrangement in order to conserve space within an enclosure or to place components that are mounted on the printed circuit boards in close proximity to one another. Unfortunately, stacking populated printed circuit boards together in this manner creates a thermal management problem for the components that are mounted on the circuit boards.
It is therefore an object of the present invention to provide a cooling apparatus for components that are mounted on stacked printed circuit boards.
SUMMARY OF THE INVENTION
In a cooling apparatus according to a preferred embodiment of the invention, heat generating components may be mounted on two sides of a first printed circuit board. A second printed circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member thermally coupled to the heat generating component on the top side of the first circuit board. The heat generating component on the bottom side of the first circuit board is thermally coupled to one leg of a thermally-conductive strap. The strap has a second leg that is thermally coupled to one end of the thermally conductive frame and also to one end of a heat distribution member mounted adjacent the second circuit board. The apparatus functions to channel heat from the top and bottom components of the first board into the heat distribution member via the thermally-conductive frame and the thermally-conductive strap.
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Belady Christian L.
Boudreaux Brent A.
Zeighami Roy M.
Hart Kevin M.
Hewlett--Packard Development Company, L.P.
Thompson Gregory D.
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