Cooling apparatus for semiconductor chips

Details Cooling apparatus for semiconductor chips Cooling apparatus for semiconductor chips

2009-11-27

2011-12-20

Smith, Courtney (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S147000, C165S185000, C361S689000, C361S690000, C361S701000, C361S707000, C361S710000, C257S713000, C257S722000

Reexamination Certificate

active

08081465

ABSTRACT:
A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other.

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