Heat exchange – Flexible envelope or cover type
Reexamination Certificate
2006-05-02
2010-12-14
Duong, Tho v (Department: 3744)
Heat exchange
Flexible envelope or cover type
C165S080400
Reexamination Certificate
active
07849914
ABSTRACT:
One embodiment of the present invention is an apparatus for cooling a microelectronic device including: (a) a rigid support ring having a top surface and a bottom surface; (b) a mechanically resilient, thermally conductive bottom membrane having a top and a bottom surface, wherein the top surface of the membrane is attached to the bottom surface of the ring; and (c) a multiplicity of thermally conductive posts having top and bottom surfaces, the posts being disposed with their bottom surfaces in thermal contact with the top surface of the bottom membrane over an area, wherein the posts are arrayed in the area with spaces therebetween so that heat transferred from the microelectronic device to the bottom surface of the membrane may be transferred to the multiplicity of thermally conductive posts.
REFERENCES:
patent: 4193445 (1980-03-01), Chu et al.
patent: 4226281 (1980-10-01), Chu
patent: 4235283 (1980-11-01), Gupta
patent: 4381032 (1983-04-01), Cutchaw
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4500945 (1985-02-01), Lipschutz
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4685211 (1987-08-01), Hagihara et al.
patent: 4693303 (1987-09-01), Okada
patent: 4721996 (1988-01-01), Tustaniwskyj et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4730665 (1988-03-01), Cutchaw
patent: 4730666 (1988-03-01), Flint et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 4750086 (1988-06-01), Mittal
patent: 4783721 (1988-11-01), Yamamoto et al.
patent: 4794981 (1989-01-01), Mizuno
patent: 4800956 (1989-01-01), Hamburgen
patent: 4847731 (1989-07-01), Smolley
patent: 4854377 (1989-08-01), Komoto et al.
patent: 4879629 (1989-11-01), Tustaniwskyj et al.
patent: 4884167 (1989-11-01), Mine
patent: 4884169 (1989-11-01), Cutchaw
patent: 4933747 (1990-06-01), Schroeder
patent: 4938279 (1990-07-01), Betker
patent: 4942497 (1990-07-01), Mine et al.
patent: 4964458 (1990-10-01), Flint et al.
patent: 5022462 (1991-06-01), Flint et al.
patent: 5083373 (1992-01-01), Hamburgen
patent: 5168348 (1992-12-01), Chu et al.
patent: 5228502 (1993-07-01), Chu et al.
patent: 5349823 (1994-09-01), Solomon
patent: 5360993 (1994-11-01), Mine
patent: 5388635 (1995-02-01), Gruber et al.
patent: 5517753 (1996-05-01), Messina
patent: 5586005 (1996-12-01), Cipolla et al.
patent: 5706171 (1998-01-01), Edwards et al.
patent: 5719443 (1998-02-01), Messina
patent: 5881945 (1999-03-01), Edwards et al.
patent: 5918665 (1999-07-01), Babcock et al.
patent: 5982038 (1999-11-01), Toy et al.
patent: 6317326 (2001-11-01), Vogel et al.
patent: 6373133 (2002-04-01), DiGiacomo et al.
patent: 6392431 (2002-05-01), Jones
patent: 6528878 (2003-03-01), Daikoku et al.
patent: 6587345 (2003-07-01), Chu et al.
patent: 7079393 (2006-07-01), Colgan et al.
patent: 2004/0207985 (2004-10-01), Delano et al.
“Thermal Conduction Module Cooling” IBM Tech Disc. Bull. p. 531, Jul. 1983.
“Thermal Conduction Module with Finned Pistons Having Star-Shaped or Gear-Like Upper Section” IBM Tech Disc. Bull. pp. 6869-6870, May 1985.
“Thermal Conduction Module with Spring Sturcture Holding Cold Plate to Hat” IBM Tech Disc. Bull. p. 3214, Dec. 1985.
“Thermal Conduction Module with Wetted Interface Between Hat and Cold Plate Established . . . ” IBM Tech Disc. Bull. p. 750, Jul. 1986.
“Thermal Conduction Module (Tcm) with Mounting Plate Carrying Pistons for Applying Force to . . . ” IBM Tech Disc. Bull. p. 2876, Dec. 1986.
“Thermal Conduction Module with Integrated Cold Plate and Individual Cylinders for Pistons” IBM Tech Disc. Bull. pp. 5148-5149, Apr. 1987.
“Thermal Conduction Module with Helical Pistons” IBM Tech Disc. Bull. pp. 347-348, Jun. 1987.
“Thermal Conduction Module with Improved Piston for Thermal Transfer Between Chip & Hat . . . ” IBM Tech Disc. Bull. Mar. 1988.
“Thermal Conduction Module (TCM) with Multi-Part Piston Having a Central Piston or Multiple . . . ” IBM Tech Disc. Bull. May 1989.
“Thermal Conduction Module (TCM) Having Hollow Pistons with Internal Fins and Containing . . . ” IBM Tech Disc. Bull. May 1989.
“Thermal Conduction Module (TCM) with Water Circulated Through Pistons” IBM Tech Disc. Bull. Aug. 1989.
“Thermal Conduction Module with Integral Cold Plate Formed by a Cover Plate and a Seal” IBM Tech Disc. Bull. pp. 447-448, Aug. 1989.
“Thermal Condcution Module with Pistons Having Channels for Carrying a Cooling Liquid . . . ” IBM Tech Disc. Bull. p. 6898, May 1985.
“Thermal Conduction Module with Liquid Dielectric and Pistons with Surface Treatment . . . ” IBM Tech Disc. Bull. p. 6904, May 1985.
Di Stefano Peter T.
Di Stefano Thomas H.
Clockspeed, Inc.
Duong Tho v
Einschlag Michael B.
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