Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-10-28
1999-07-20
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257717, 257722, 361699, 165 804, H01L 2334
Patent
active
059259299
ABSTRACT:
A cooling apparatus for electronic device comprises an electronic element unit which comprises a base member, a thermal conductive electric insulating layer soldered to the base member and a plurality of electronic elements soldered to the thermal conductive electric insulating layer at least one cooling unit which is detachably kept in pressure contact with the base member of the electronic element unit and comprises a cooling block, at least one heat pipe having a refrigerant sealingly contained therein and inserted in the cooling block at one end thereof and a plurality of radiation fins provided at the other end of the at least one heat pipe; and a device which serves to detachably keep the electronic element unit and the cooling unit in pressure contact with each other. The other end of the heat pipe extends obliquely with a predetermined angle (.alpha.) with respect to the inserted portion thereof.
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Hybride leistungs-IC, Werner Bresch, Technische Rundschau 78 (1986) Nov., No. 45, pp. 106-109, Aug. 1995.
Fujioka Kazumasa
Kuwahara Heikichi
Saitoo Syuuji
Takasaki Toshio
Toyota Eiichi
Arroyo Teresa M.
Hitachi , Ltd.
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