Cooling apparatus for electronic devices

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361687, 361692, 361695, 361727, 257713, 257717, 257726, 165 803, 165121, 165185, 174 163, 174252, 415178, H05K 720

Patent

active

061575399

ABSTRACT:
A cooling system for dissipating heat from a heat source is disclosed. The cooling system comprises a heat sink associated with a divider member. The heat sink includes a heat conductive base portion having a surface adapted to contact the heat source. The base portion has a peripheral wall member extending from the heat conductive base portion wherein the peripheral wall member defines a chamber therewithin and a heat sink device exterior located on the opposite side of the peripheral wall member from the chamber. A plurality of openings extend through the peripheral wall member between the heat sink device exterior and the chamber. An intake airflow path extends from the heat sink device exterior through a first portion of the plurality of openings to the chamber. An exhaust airflow path extends from the chamber through a second portion of the plurality of openings to the heat sink device exterior. A divider member is positioned adjacent the exterior of the heat sink device and separates the intake and exhaust airflow paths.

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