Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-04-15
1998-01-06
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257723, 361697, H01L 2334
Patent
active
057058547
ABSTRACT:
A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13. The nozzles 14 have a substantially rectangular cross section parallel to the board, and are designed such that, when the ratio of the distance between the adjacent heat sinks to the pitch of the plurality of mounted heat sinks is not less than 0.00 but below 0.02, the ratio of the width of the nozzles 14 in the direction (X direction) that a refrigerant flows within the heat sinks 13 to the width of the heat sinks 13 is not less than 0.16 and not more than 0.35.
REFERENCES:
patent: 5570740 (1996-11-01), Flores et al.
patent: 5576932 (1996-11-01), Bishop et al.
patent: 5592363 (1997-01-01), Atarashi et al.
Atarashi Takayuki
Daikoku Takahiro
Tanaka Tetsuya
Hitachi , Ltd.
Potter Roy
Thomas Tom
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