Cooling apparatus for electronic device

Details Cooling apparatus for electronic device Cooling apparatus for electronic device

1989-09-25

1992-06-30

LaRoche, Eugene R.

357 74, 357 75, 357 80, 357 81, H01L 2504

Patent

active

051268299

ABSTRACT:
A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.

REFERENCES:
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4567205 (1983-10-01), Pease et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4621304 (1986-11-01), Oagaki et al.
patent: 4639829 (1987-01-01), Ostergren
patent: 4761518 (1988-08-01), Butt
IBM Technical Disclosure Bulletin, Circuit Package with Spring-Loaded Pistons Holding Cooling Plate Against Chip and with Flexible Material Holding Cooling Plates and Sealing Chips from a Cooling Fluid, vol. 28 No. 7 Dec. 1985, pp. 3066-3067.

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