Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1992-02-20
1994-09-06
Nguyen, Viet Q.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257714, 257718, 257719, 257720, 361704, 165185, F28F 700, H05K 720, H01L 2300
Patent
active
053451074
ABSTRACT:
The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
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IBM T.D.B., vol. 28, No. 7 (1985).
"Compliant Cold Plate Cooling Scheme", IBM TDB, vol. 21, No. 6, Nov. 1978, p. 2431.
Lynch et al, "Cooling Assembly for Integrated Circuit Chip", IBM TDB, vol. 20, No. 1, Jun. 1979, p. 143.
Ashiwake Noriyuki
Daikoku Takahiro
Kawamura Keizou
Kawasaki Nobuo
Miyamoto Mitsuo
Hitachi , Ltd.
Nguyen Viet Q.
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